Testing Products for ASTM D229
APP-D229Rigid Sheet and Plate Materials for Electrical Insulation. Multi-test standard for laminates.
Application Insight:
Includes dielectric strength, but UTM is used for the mechanical Bond Strength and Flexure.
Pro Tip:
Safety: These materials can be brittle; ensure the debris shield is used during high-load flexure.
Regulatory & Test Details
| App Id | APP-D229 |
|---|---|
| App Standard | ASTM D229 |
| Standard Organization | ASTM |
| Test Type | Tension/Flex |
| Material Type | Electrical Laminates |
| Specimen Type | Sheet/Plate |
| Industry Type | Electronics |
| Min Force Kn | 1 |
| Max Force Kn | 100 |
| Max Spd Mm/m | 10 |
| Pointer App Software | N-ASTM-D229 |
| Pointer Fixture Family | G-ASTM-D229 |
| Pointer Strain Family | E-ASTM-D229 |
Implementation Commentary
Used to characterize FR-4 and other PCB substrates. The Bond Strength test involves a perpendicular pin-pull through the laminate.
Common Pitfalls
Testing perpendicular vs. parallel to the laminations without documenting the orientation.